Fraunhofer Center for Sensor Intelligence ZSI
The Fraunhofer ZSI uses two SMD placement machines (Essemtec) to quickly, flexibly and precisely assemble electronic assemblies with SMD components for research and development projects.
These can assemble both large BGA components, such as FPGAs, and very small components (up to size 0201) fully automatically. Complex circuit boards with a high degree of technology can be produced as well as miniaturized low-cost sensor systems.
The use of this technology enables us to assemble printed circuit boards in small batches cost-effectively and very quickly with very little manpower using state-of-the-art technology. On the one hand, this increases quality and production speed and also enables us to quickly meet the needs of current projects.